Microelectronic Packaging Engineer | Intel

Date Posted: 
Thursday, September 17, 2015
Position Location: 
Phoenix, AZ
Job Description: 

Microelectronic Packaging Engineer defines and establishes process flow, procedures, and roadmaps for substrate fine feature patterning and registration. In this position, you will be in the role of laser technology development for microelectronic packaging to meet quality, reliability, cost, yield, productivity and manufacturing requirements. Responsibilities include: researching and benchmarking on laser technologies for microelectronic packaging and drive the equipment development to meet Intel roadmap; innovating, problem solving, developing, and continuously improving laser processes in substrate manufacturing; provides project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies; interacts with substrate/materials/equipment suppliers, and international travel is required for supplier management.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • The candidate must possess a Ph.D. in Materials Science, Mechanical Engineering, Physics, Optics, or relevant disciplines.
  • Candidate must have 6 + months of work or educational experience in the following:
  • Laser material processing, laser micromachining, and laser via drilling

Preferred Qualifications:

  • Background in laser-materials interaction, materials microstructure and mechanical and physical properties of materials (polymers, composites, metals and ceramics)
  • Skills in materials characterization (such as SEM, AFM, XPS, TEM, etc.)
  • Expertise desired includes laser engineering, laser beam steering, optics, thermal analysis, and critical dimension characterization